ARTICLES/PRESENTATIONS

Diamond Heat Spreaders Maximize Emitter Power and Lifetime
published in Laser Focus World, May 2006.

Taking a Photonic Device from Prototype to Manufacturing:
10 Common Pitfalls and How to Avoid Them
presented at IEEE's Photonic Devices & Systems Packaging Symposium (PhoPack) 2002.

Market Pull vs. Technology Push:
Trends In Photonic Device Packaging & Automated Assembly After The Bubble

presented at Fiberoptic Automation EXPO 2002.

Laser-weld Attachment Enables Repeatable Submicron Precision
published in the Optical Manufacturing Journal 2002.

Why Outsource Optoelectronics Manufacturing? published in the MEPTEC Report 2001.

Challenges in Optoelectronic Packaging, presented at IMAPS-UK 2000.


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