Diamond Heat Spreaders Maximize Emitter Power and Lifetime
published in Laser Focus World, May 2006.
Taking a Photonic Device from Prototype to Manufacturing:
10 Common Pitfalls and How to Avoid Them
presented at IEEE's Photonic Devices & Systems Packaging Symposium (PhoPack) 2002.
Market Pull vs. Technology Push:
Trends In Photonic Device Packaging & Automated Assembly After The Bubble
presented at Fiberoptic Automation EXPO 2002.
Laser-weld Attachment Enables Repeatable Submicron Precision
published in the Optical Manufacturing Journal 2002.
Why Outsource Optoelectronics Manufacturing?
published in the MEPTEC Report 2001.
Challenges in Optoelectronic Packaging,
presented at IMAPS-UK 2000.